Electrical Engineering, Electronics --> Electronic Packaging exhibition calendar



OVERSEAS TRADE FAIRS
ORGANIZER
DATE
SMT Hybrid Packaging 2018Mesago Messe Frankfu05 - 07 June 2018
productronica 2017Messe München GmbH14 - 17 November 2017
SMT Hybrid Packaging 2017Mesago Messe Frankfu16 - 18 May 2017
INTERNEPCON JAPAN 2017Reed Exhibitions Jap18 - 20 January 2017
SMT Hybrid Packaging 2016Mesago Messe Frankfu26 - 28 April 2016
INTERNEPCON JAPAN 2016Reed Exhibitions Jap13 - 15 January 2016
productronica 2015Messe München GmbH10 - 13 November 2015
Electronics New England 2015UBM Canon06 - 07 May 2015
SMT Hybrid Packaging 2015Mesago Messe Frankfu05 - 07 May 2015
NEPCON China 2015Reed Huayin (Shangha21 - 23 April 2015
LOPEC 2015Messe München GmbH04 - 05 March 2015
Internepcon Japan 2014Reed Exhibitions Jap15 - 17 June 2014
SMT Hybrid Packaging 2014Nürnberg Global Fair06 - 08 May 2014
Nepcon Korea & SMT/PCB 2014K. Fairs Ltd.02 - 04 April 2014
Internepcon Japan 2014Reed Exhibitions Jap15 - 17 January 2014
productronica 2013Messe München GmbH12 - 15 November 2013
NEPCON / EMT South China 2013Reed Exhibitions (Ch27 - 29 August 2013
NEPCON / EMT South China 2013Reed Exhibitions (Ch26 August 2013 - 28 August 2014
NEPCON THAILAND 2013Reed Tradex Company 20 - 23 June 2013
LOPE-C 2013Messe München GmbH11 - 13 June 2013
NEPCON China 2013Reed Elsevier (Singa23 - 25 April 2013
Smt/Hybrid/Packaging 2013Mesago Messe Frankfu16 - 18 April 2013
SMT Hybrid Packaging 2013Mesago Messe Frankfu16 - 18 April 2013
Electronics New England ( 2013UBM Canon (Canon Com10 - 11 April 2013
Nepcon Korea & SMT/PCB 2013K. Fairs Ltd.20 - 22 March 2013
Internepcon Japan 2013Reed Exhibitions Jap16 - 18 January 2013
Messe Frankfurt
Reklam
Reklam
Reklam
Reklam
Reklam