-2018


INTERMOLD which is going to arrive on 01.04.2018 to 01.04.2018 at Osaka, Japonya a b2b event organized by INTERMOLD Development Association (I.T.P.) and focussed on Foundry, Mould, Metallurgy, Non-Ferrous Netals, Metalworking and Welding Technology industries

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Trade Fair Name:INTERMOLD-2018
Description:Japan International Die and Mold Manufacturing Technology Exhibition
Fair Ground: INTEX Osaka - International Exhibition Center Osaka
City: Osaka
Country: Japan
Date:01 April 2018 - (Please get confirmation from organizer.)
Sector:Foundry, Mould, Metallurgy, Non-Ferrous Netals, Metalworking, Welding Technology

Organizer Info:INTERMOLD Development Association (I.T.P.)
Address:1-2-15, Otemae, Chuo-ku Osaka 540-0008
Phone:+81 6 6944-9916
Fax:+81 6 6944-9912
 

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