-2018
SMT Hybrid Packaging which is going to arrive on 05.06.2018 to 07.06.2018 at Nürnberg, Almanya a b2b event organized by Mesago Messe Frankfurt GmbH and focussed on Electrical Engineering, Electronics, Electrical Engineering, Electronics, Engineering, Design and Surface treatment industries
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| Trade Fair Name | : | SMT Hybrid Packaging-2018 | |
| Description | : | System Integration in Micro Electronics | |
| Fair Ground | : | NürnbergMesse GmbH  |
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| City | : | Nuremberg | |
| Country | : | Germany | |
| Date | : | 05 - 07 June 2018 - (Please get confirmation from organizer.) | |
| Sector | : | Electrical Engineering, Electronics, Electrical Engineering, Electronics, Engineering, Design, Surface treatment | |
| Organizer Info | : | Mesago Messe Frankfurt GmbH |
| Address | : | Rotebühlstr. 83-85 · 70178 Stuttgart |
| Phone | : | 0711-61946-09 |
| Fax | : | 0711-61946-91 |
| Representative | : | Messe Frankfurt Istanbul Uluslararası Fuarcılık Ltd.Şti. |
| Address | : | Ömer Avni Mah. İnönü Cad. No:50 Devres Han K:2/S Beyoğlu 34427 Istanbul TURKEY |
| Phone | : | 212-296 26 26 |
| Fax | : | 212-296 43 60 |
| Product Groups | : | Printed Circuit Boards, Surface Mount Technology, Hybrid Circuits, Printed Circuit Boards Production, Electronic Packaging, Jointing Equipment, CAE, Insertion Machines, Measuring Systems, Testing Technology, Soldering Apparatus, Screen Printing, Chemical Bases, Semiconductor Production, Measuring Equipment, Testing Equipment, Tools, |
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